Microwave integrated circuit
US5898200A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 18, 1997 |
| Grant date | Apr 27, 1999 |
| Priority date | — |
| Expiry date | Sep 18, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed in a microwave integrated circuit, having a semiconductor substrate on which a field effect transistor is formed, a micro strip line, a contact hole and an interconnecting line. The microstrip line comprises a ground conductor, a signal line and a dielectric film interposed between the ground conductor and the signal line, and it is laminated on the semiconductor substrate. The contact hole is formed in the micro strip line so that the dielectric film above the field effect transistor is removed, and the interconnecting line is provided in the contact hole for connecting the field effect transistor with the ground conductor or signal line of the micro strip line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.