Bump bonder with a discard bonding area
US5899375A · kind A · utility
4Cited by
7References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 24, 1997 |
| Grant date | May 4, 1999 |
| Priority date | — |
| Expiry date | Sep 24, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0781
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The object is to provide a bump bonder wherein the drop of the tact efficiency of bump formation can be reduced to a low level by discard-bonding of unsatisfactory balls (3) so that satisfactory bumps can be formed. It features arranging a discard bonding chip (19) on bonding stage (17), which holds in their prescribed positions the semiconductor chips (13a), (13b) that are to be subjected to bump formation and performing discard bonding to discard bonding chip (19). Due to this construction, discard bonding can be effected without needing to move the capillary far from the bonding stage (17), which is the working position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.