Takahiro Yonezawa
22Patents
8h-index
38Co-inventors
75Inventor score
Filing activity: Aug 27, 1992 → Feb 28, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5686353A | Semiconductor device and manufacturing method thereof | Electricity | 97 | Expired |
| US6017812A | Bump bonding method and bump bonding apparatus | Electricity | 71 | Expired |
| US6207549A | Method of forming a ball bond using a bonding capillary | Emerging Cross-Sectional Technologies | 27 | Expired |
| US5457874A | Mounting apparatus of electronic component | Emerging Cross-Sectional Technologies | 15 | Expired |
| US5667130A | Ultrasonic wire bonding apparatus and method | Electricity | 13 | Expired |
| US5339248A | Apparatus for mounting electronic component on substrate | Emerging Cross-Sectional Technologies | 11 | Expired |
| US6332268A | Method and apparatus for packaging IC chip, and tape-shaped carrier to be used therefor | Emerging Cross-Sectional Technologies | 9 | Expired |
| US6474538B1 | Bonding apparatus and bonding method | Electricity | 9 | Expired |
| US6902101B2 | Bump bonding method apparatus | Electricity | 8 | Expired |
| US6667250B2 | Film substrate treatment apparatus, film substrate treatment method, and film substrate transport method | Emerging Cross-Sectional Technologies | 5 | Expired |
| US6619535B1 | Working method for holding a work object by suction | Electricity | 5 | Expired |
| US5899140A | Bump levelling method and bump levelling apparatus | Electricity | 5 | Expired |
| US5899375A | Bump bonder with a discard bonding area | Electricity | 4 | Expired |
| US6328196A | Bump bonding device and bump bonding method | Electricity | 4 | Expired |
| US7071090B2 | Semiconductor element having protruded bump electrodes | Emerging Cross-Sectional Technologies | 3 | Expired |
| US6894387B2 | Semiconductor element having protruded bump electrodes | Emerging Cross-Sectional Technologies | 3 | Expired |
| US6712111B2 | Bonding method and apparatus | Emerging Cross-Sectional Technologies | 2 | Expired |
| US7246430B2 | Electronic component mounting apparatus and electronic component mounting method | Emerging Cross-Sectional Technologies | 2 | Expired |
| US6680221B2 | Bare chip mounting method and bare chip mounting system | Electricity | 1 | Expired |
| US6481616B2 | Bump bonding device and bump bonding method | Electricity | 0 | Expired |
| US8624649B2 | Delay measuring circuit and delay measuring method | Physics | 0 | Active |
| US12354837B2 | Plasma processing method and plasma processing apparatus | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.