Inspection method and device of wafer surface
US5903342A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 8, 1996 |
| Grant date | May 11, 1999 |
| Priority date | — |
| Expiry date | Apr 8, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/94
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A wafer surface inspection method and device including a low angle light receiving system having an elevation angle less than 30.degree. with reference to the wafer surface, and a high angle light receiving system having an elevation angle equal to or larger than 30.degree., scans the wafer with a laser beam, receives scattered light to perform extraneous substance detection in response to the scanning, and detects wafer defects only by the high angle light receiving system, and sticking extraneous substances by either the low angle receiving system or by both the low angle light receiving system and the high angle light receiving system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.