Heat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic device
US5905636A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 23, 1998 |
| Grant date | May 18, 1999 |
| Priority date | — |
| Expiry date | Jan 23, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for dissipating heat generated by an electronic device and a method for mounting the apparatus to an electronic device are disclosed. The apparatus includes a heat transfer body which is mounted in proximity to an electronic device. In addition, the apparatus includes an adhesive distributed on the heat transfer body, which affixes the heat transfer body in proximity to the electronic device. The adhesive is distributed on the heat transfer body such that heat transfer from the electronic device to the heat transfer body occurs substantially independently from the adhesive. The apparatus further includes a thermally conductive material disposed between the electronic device and the heat transfer body. The thermally conductive material is selected to maximize heat transfer from the electronic device to the heat transfer body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.