Processes for forming resist pattern and for producing semiconductor device
US5906912A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 11, 1997 |
| Grant date | May 25, 1999 |
| Priority date | — |
| Expiry date | Apr 11, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76838
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electroconductive pattern is formed by coating a substrate with a solution comprising 100 parts by weight of a soluble electroconductive polymer containing an organic radical capable of cross-linking with a cross-linking agent, 5 to 1,000 parts by weight of a cross-linking agent, and 100 to 100,000 parts by weight of a solvent; effecting cross-linking of the resultant coated film to obtain a cured electroconductive film having a sheet resistance of 10.sup.10 .OMEGA./.quadrature. or less; forming a pattern as an upper layer on the cured electroconductive layer; and transferring the pattern of the upper layer to the cured electroconductive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.