Semiconductor device capable of easily filling contact conductor plug in contact hole
US5907788A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 16, 1998 |
| Grant date | May 25, 1999 |
| Priority date | — |
| Expiry date | Jun 16, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B12/315
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a semiconductor device having an impurity diffusion layer in a surface part of a semiconductor surface and a first insulator layer formed on the semiconductor substrate and the impurity diffusion layer, the first insulator layer has a first recessed surface which defines a first contact hole. A first contact conductor plug is filled in the first contact hole. A second insulator layer is formed on the first insulator layer and a first upper plug surface of the first contact conductor plug. The second insulator layer has a second recessed surface which defines a second contact hole exposing the first upper plug surface. A second contact conductor plug is filled in the second contact hole to overlie the first upper plug surface and to be brought into contact with the second recessed surface. A conductor pad may be disposed between the first and the second contact conductor plugs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.