Aluminum-palladium alloy for initiation of electroless plating
US5907790A · kind A · utility
257Cited by
16References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 29, 1996 |
| Grant date | May 25, 1999 |
| Priority date | — |
| Expiry date | Aug 29, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12993
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Thin layers of aluminum and palladium are deposited and annealed to produce aluminum-palladium alloy. The surface of the alloy is exposed and treated with an aluminum enchant to produce a catalytic surface. The catalytic surface is used for electroless plating of nickel, providing excellent plating uniformity and adhesion, as well as a reduced plating induction time. Several variants of the basic method are shown.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.