Multi-layer-multi-chip pyramid and circuit board structure and method of forming same
US5907903A · kind A · utility
79Cited by
15References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 8, 1998 |
| Grant date | Jun 1, 1999 |
| Priority date | — |
| Expiry date | Jan 8, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention provides multi-layer multi-chip circuit board comprising at least two ATAB carriers having chips thereon, stacked upon each other in a pyramid configuration and attached to a substrate, thus reducing the required area on the substrate for mounting components to form a circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.