Residue removal by supercritical fluids
US5908510A · kind A · utility
110Cited by
21References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 16, 1996 |
| Grant date | Jun 1, 1999 |
| Priority date | — |
| Expiry date | Oct 16, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for the removal of residue from an etched precision surface such as a semiconductor sample is provided which comprises exposing said precision surface to a supercritical fluid or liquid CO.sub.2 under appropriate conditions that are sufficient to remove the residue from the precision surface. Cryogenic aerosol may be used in conjunction with either the supercritical fluid or liquid CO.sub.2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.