Method and apparatus for modifying circuit having ball grid array interconnections
US5909011A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 1, 1996 |
| Grant date | Jun 1, 1999 |
| Priority date | — |
| Expiry date | Aug 1, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4973
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In aspect, the present invention is directed to a pad connector including a substantially flat pad portion, and a tail portion having a top portion attached to the pad portion and a bottom portion. The tail portion is angulated with respect to the pad portion. In another aspect, the present invention is directed to a method of modifying a circuit board having at least one Ball Grid Array (BGA). The method includes removing the via portion of the BGA pad from the circuit board to sever the connection between the via and the circuit, attaching the pad connector to the circuit board, and connecting the pad connector to the circuit of the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.