Wai Mon Ma
20Patents
9h-index
35Co-inventors
75Inventor score
Filing activity: Dec 19, 1988 → Jul 10, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4953929A | Fiber optic connector assembly and adapter for use therewith | Physics | 76 | Expired |
| US5872400A | High melting point solder ball coated with a low melting point solder | Emerging Cross-Sectional Technologies | 36 | Expired |
| US4907975A | Electrical connector utilizing flexible electrical circuitry | Electricity | 28 | Expired |
| US6182884A | Method and apparatus for reworking ceramic ball grid array or ceramic column grid array on circuit cards | Electricity | 16 | Expired |
| US7199309B2 | Structure for repairing or modifying surface connections on circuit boards | Emerging Cross-Sectional Technologies | 16 | Expired |
| US6050481A | Method of making a high melting point solder ball coated with a low melting point solder | Emerging Cross-Sectional Technologies | 13 | Expired |
| US6784377B2 | Method and structure for repairing or modifying surface connections on circuit boards | Emerging Cross-Sectional Technologies | 13 | Expired |
| US5909011A | Method and apparatus for modifying circuit having ball grid array interconnections | Emerging Cross-Sectional Technologies | 12 | Expired |
| US5890284A | Method for modifying circuit having ball grid array interconnections | Emerging Cross-Sectional Technologies | 12 | Expired |
| US6059172A | Method for establishing electrical communication between a first object having a solder ball and a second object | Emerging Cross-Sectional Technologies | 9 | Expired |
| US6912780B2 | Method and structure for repairing or modifying surface connections on circuit boards | Emerging Cross-Sectional Technologies | 8 | Expired |
| US6511347B2 | Terminating floating signals on a BGA module to a ground plane on a ball grid array (BGA) circuit board site | Electricity | 7 | Expired |
| US6437252B1 | Method and structure for reducing power noise | Emerging Cross-Sectional Technologies | 5 | Expired |
| US7841078B2 | Method of optimizing land grid array geometry | Emerging Cross-Sectional Technologies | 5 | Active |
| US6016947A | Non-destructive low melt test for off-composition solder | Electricity | 3 | Expired |
| US8638564B2 | Dye-based circuit mount testing | Electricity | 3 | Active |
| US6974071B2 | Inclined solder wave methodology for wave soldering double sided pin-in-hole electronic components | Electricity | 3 | Expired |
| US9459285B2 | Test probe coated with conductive elastomer for testing of backdrilled plated through holes in printed circuit board assembly | Physics | 2 | Active |
| US8939791B2 | Primary circuit board non-conductive void having different planar dimensions through board thickness to secure non-conducting locking member of holder | Emerging Cross-Sectional Technologies | 0 | Active |
| US8902605B2 | Adapter for plated through hole mounting of surface mount component | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.