Integrated heat spreader/stiffener with apertures for semiconductor package
US5909057A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 23, 1997 |
| Grant date | Jun 1, 1999 |
| Priority date | — |
| Expiry date | Sep 23, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16195
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a single-piece integrated heat spreader/stiffener which is bonded to the substrate and die in a semiconductor package following electrical bonding of the die to the substrate, a packaging method using the integrated heat spreader/stiffener, and a semiconductor package incorporating the integrated heat spreader/stiffener. In a preferred embodiment, the integrated heat spreader/stiffener is a piece of high modulus, high thermal conductivity material shaped to attach over a die on the surface of a packaging substrate. The heat spreader/stiffener is equipped with a plurality of apertures to provide access to the top surface of the die for adhesive to bond the heat spreader/stiffener to the die, and to its perimeter to provide access for dispensation of underfill material between the die and the substrate. Once the adhesive and underfill materials are in place, the adhesive and underfill resins are cured by heating. A ball grid array (BGA) process may then be used to apply solder balls to the underside of the substrate for subsequent bonding of the package to a circuit board for use.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.