John McCormick
34Patents
18h-index
15Co-inventors
78Inventor score
Filing activity: Sep 27, 1974 → Aug 9, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5831836A | Power plane for semiconductor device | Electricity | 126 | Expired |
| US5801432A | Electronic system using multi-layer tab tape semiconductor device having distinct signal, power and ground planes | Electricity | 100 | Expired |
| US6369448B1 | Vertically integrated flip chip semiconductor package | Electricity | 95 | Expired |
| US6166434A | Die clip assembly for semiconductor package | Electricity | 85 | Expired |
| US5909057A | Integrated heat spreader/stiffener with apertures for semiconductor package | Electricity | 82 | Expired |
| US5552631A | Semiconductor device assembly including power or ground plane which is provided on opposite surface of insulating layer from signal traces, and is exposed to central opening in insulating layer for interconnection to semiconductor die | Emerging Cross-Sectional Technologies | 55 | Expired |
| US5410451A | Location and standoff pins for chip on tape | Emerging Cross-Sectional Technologies | 53 | Expired |
| US6558978B1 | Chip-over-chip integrated circuit package | Electricity | 50 | Expired |
| US6294840A | Dual-thickness solder mask in integrated circuit package | Electricity | 43 | Expired |
| US5550406A | Multi-layer tab tape having distinct signal, power and ground planes and wafer probe card with multi-layer substrate | Emerging Cross-Sectional Technologies | 39 | Expired |
| US5898575A | Support assembly for mounting an integrated circuit package on a surface | Emerging Cross-Sectional Technologies | 33 | Expired |
| US5638596A | Method of employing multi-layer tab tape in semiconductor device assembly by selecting, breaking, downwardly bending and bonding tab tape trace free ends to a ground or power plane | Emerging Cross-Sectional Technologies | 32 | Expired |
| US5763952A | Multi-layer tape having distinct signal, power and ground planes, semiconductor device assembly employing same, apparatus for and method of assembling same | Emerging Cross-Sectional Technologies | 25 | Expired |
| US5639385A | Method of fabricating a wafer probe card for testing an integrated circuit die | Emerging Cross-Sectional Technologies | 24 | Expired |
| US5681777A | Process for manufacturing a multi-layer tab tape semiconductor device | Emerging Cross-Sectional Technologies | 23 | Expired |
| US6008991A | Electronic system including packaged integrated circuits with heat spreading standoff support members | Electricity | 21 | Expired |
| US6002171A | Integrated heat spreader/stiffener assembly and method of assembly for semiconductor package | Electricity | 20 | Expired |
| US6171888A | Multi-layer tab tape having distinct signal, power and ground planes, semiconductor device assembly employing same, apparatus for and method of assembling same | Electricity | 19 | Expired |
| US8536458B1 | Fine pitch copper pillar package and method | Emerging Cross-Sectional Technologies | 18 | Active |
| US6431432B1 | Method for attaching solderballs by selectively oxidizing traces | Electricity | 17 | Expired |
| US9462690B1 | Fine pitch copper pillar package and method | Emerging Cross-Sectional Technologies | 14 | Active |
| US5854085A | Multi-layer tab tape having distinct signal, power and ground planes, semiconductor device assembly employing same, apparatus for and method of assembling same | Electricity | 14 | Expired |
| US6706622B1 | Bonding pad interface | Electricity | 13 | Expired |
| US8786075B1 | Electrical circuit with component-accommodating lid | Electricity | 6 | Active |
| US3939699A | Tensiometer with remote sensing unit | Physics | 6 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.