Method of sequential laser processing to efficiently manufacture modules requiring large volumetric density material removal for micro-via formation
US5910255A · kind A · utility
30Cited by
43References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 8, 1996 |
| Grant date | Jun 8, 1999 |
| Priority date | — |
| Expiry date | Nov 8, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for forming a blind-via in a laminated substrate by laser drilling a blind-via from a top surface of the substrate toward a bottom surface of the substrate using a first laser and a first trepanning motion of a laser focal spot of the first laser. Then, the via is laser drilled from the top surface toward the bottom surface using a second laser and a second trepanning motion of a laser focal spot of the second laser.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.