Method of manufacturing a composite substrate and a piezoelectric device using the substrate
US5910699A · kind A · utility
33Cited by
4References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 16, 1997 |
| Grant date | Jun 8, 1999 |
| Priority date | — |
| Expiry date | Jun 16, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1082
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a composite substrate and the composite substrate manufactured thereby wherein surfaces of first and second substrates having different thermal expansion coefficients are mirror finished and layered on each other. A first heat treatment is applied after which a part of the second substrate is removed to a depth sufficient to expose the first substrate. A final second heat treatment directly bonds the substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.