Method of etching a bond pad
US5911887A · kind A · utility
18Cited by
20References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 19, 1996 |
| Grant date | Jun 15, 1999 |
| Priority date | — |
| Expiry date | Jul 19, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19042
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This invention relates to a method of etching a bond pad in a semiconductor or integrated circuit, a method of using an etching apparatus and a semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.