Bonding structure for an electronic device
US5912510A · kind A · utility
57Cited by
11References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 29, 1996 |
| Grant date | Jun 15, 1999 |
| Priority date | — |
| Expiry date | May 29, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10674
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bonding structure (10) is formed between a first component (12) and a second component (11) to form a semiconductor device. The bonding structure (10) comprises a bump (24) that has a pedestal region (22) and a crown region (23). The crown region (23) is anchored into a well region (13) of a conductive material (16) that is formed on the second component (11).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.