Method for fabricating thermally stable contacts with a diffusion barrier formed at high temperatures
US5913145A · kind A · utility
80Cited by
4References
13Claims
0Family size
Assignee
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Key dates
| Filing date | Aug 28, 1997 |
| Grant date | Jun 15, 1999 |
| Priority date | — |
| Expiry date | Aug 28, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/927
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In order to provide a thermally stable diffusion barrier for a contact, a layer of titanium is formed on the patterned substrate. A layer of tungsten nitride is formed on the titanium layer. After an annealing step, an interfacial layer and a layer of titanium nitride are formed between the substrate and a tungsten layer. These layers provide a diffusion barrier which is more thermally stable than a titanium nitride layer applied directly on the substrate and permits the formation of a contact structures that can withstand subsequent high temperature steps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.