Thermally-enhanced lead frame with reduced thermal gap
US5914528A · kind A · utility
10Cited by
14References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 28, 1997 |
| Grant date | Jun 22, 1999 |
| Priority date | — |
| Expiry date | Apr 28, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead frame structure includes a lead frame skeleton and at least one die bar connected between the lead frame skeleton and a non-quadrangular die attach paddle. Each of a plurality of leads has an outer edge connected to the lead frame skeleton and an inner edge disposed adjacent to but separated from the periphery of the die attach paddle. Preferably, the inner edge of each lead is separated from the periphery of the die attach paddle by about 5-10 mils.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.