Kuan L. Chen
2Patents
2h-index
6Co-inventors
27Inventor score
Filing activity: Feb 11, 1997 → Apr 28, 1997
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5825084A | Single-core two-side substrate with u-strip and co-planar signal traces, and power and ground planes through split-wrap-around (SWA) or split-via-connections (SVC) for packaging IC devices | Electricity | 75 | Expired |
| US5914528A | Thermally-enhanced lead frame with reduced thermal gap | Electricity | 10 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.