Patent · US Expired

Multilayer module with thinfilm redistribution area

US5914533A · kind A · utility

22Cited by

1References

7Claims

0Family size

Assignee

International Business Machines Corporation · US

Inventors

Roland Frech · Esslingen am Neckar, DE
Hubert Harrer · Böblingen, DE
Erich Klink · Schenefeld, DE
William F. Shutler · Wappingers Falls, US

Key dates

Filing date	Jan 10, 1997
Grant date	Jun 22, 1999
Priority date	—
Expiry date	Jan 10, 2017

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3011
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The invention relates to a multilayer module 20 for packaging of at least one electronic component, such as the integrated circuit chips 21, 22. The module 20 comprises a thickfilm structure and a thinfilm structure. The thinfilm structure provides an interface between the electronic components and the thickfilm structure. The thinfilm structure comprises a first powerplane and a redistribution wiring structure. The topmost layer of conductors of the thickfilm structure is a second powerplane so that an electrical structure approaching a triplate structure is realized.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.