Circuit-board overlaid with a copper material on both sides or in multiple layers and a method of fabricating same

US5914861A · kind A · utility

Assignees

• Siemens Aktiengesellschaft · DE
• PPC Electronic AG · CH

Inventors

• Dietrich Richter · Berlin, DE
• Peter Straub · Zug, CH
• Marian Lancki · Berlin, DE
• Peter Diehm · Rotkreuz, CH
• Dieter Berchtold · Stade, DE
• Hans-Georg Wissmeier · Hersbruck, DE

Key dates

• Filing date: Dec 22, 1997
• Grant date: Jun 22, 1999
• Expiry date: Dec 22, 2017

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S428/901
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

A circuit-board overlaid with a copper material on both sides with a lead-tin layer on the copper material and a plate-shaped heat sink (6). To achieve desirable dissipation of heat generated by electronic components on such circuit-board, the heat sink (6) is provided with a copper surface and then a layer of silver (8) applied to it is soldered to one side of the circuit-board (1). In a method of fabricating the circuit-board, a heat sink (6) having a copper surface is provided with a silver layer (8) and is applied to the circuit board (1) with its side (7) having the silver layer (8). The heat sink (6) is pressed with the circuit board (1) and a heated platen (20) in close contact with the heat sink (6).