Dieter Berchtold
2Patents
1h-index
5Co-inventors
30Inventor score
Filing activity: Dec 22, 1997 → Mar 18, 1999
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5914861A | Circuit-board overlaid with a copper material on both sides or in multiple layers and a method of fabricating same | Emerging Cross-Sectional Technologies | 3 | Expired |
| US6116495A | Circuit-board overlaid with a copper material on both sides or in multiple layers and a method of fabricating same | Emerging Cross-Sectional Technologies | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.