Circuit board having electrodes and pre-deposit solder receiver
US5917156A · kind A · utility
31Cited by
7References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 29, 1995 |
| Grant date | Jun 29, 1999 |
| Priority date | — |
| Expiry date | Aug 29, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Copper electrodes are formed on a circuit board to be bonded with leads of a TAB driving liquid crystal. A pre-deposit solder receiver having solder printed thereon is also provided on the circuit board in alignment with and prior to an electrode to be first bonded with a lead, to form a sufficient solder pool between plural electrodes and a bottom wall of a soldering iron. Solder/bonding is accordingly realized efficiently even from a starting electrode E1. Also, an excessive solder receiver may be provided in alignment with and after an electrode to be last bonded with a lead.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.