Apparatus for polishing substrate using resin film or multilayer polishing pad
US5921853A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Mar 4, 1997 |
| Grant date | Jul 13, 1999 |
| Priority date | — |
| Expiry date | Mar 4, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B57/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An elastic polishing pad is adhered to the top face of a rotatable table. Above the table is provided a substrate holding apparatus for holding a substrate. The substrate holding apparatus comprises a rotary shaft, a substrate holding head in the form of a disc which is provided integrally with the lower edge of the rotary shaft, a sealing member in the form of a ring which is made of an elastic material and fastened to the peripheral portion of the lower face of the substrate holding head, and a guiding member in the form of a ring which is fastened to the back face of the substrate holding head to be located outside the sealing member. A fluid under pressure is introduced into a fluid flow path formed in the rotary shaft from one end thereof and supplied to a space from the other end of the fluid flow path so as to press the substrate against the polishing pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.