Process for plating
US5922414A · kind A · utility
2Cited by
12References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 9, 1997 |
| Grant date | Jul 13, 1999 |
| Priority date | — |
| Expiry date | Dec 9, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/0023
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A composition comprising at least two resins with widely different molecular weights is disclosed. The composition is particularly suitable as a permanent dielectric which provides an optimum surface for plating upon. The composition is particularly useful in the fabrication of printed circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.