Patent · US Expired

Method for manufacturing a semiconductor device

US5923962A · kind A · utility

979Cited by
14References
32Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 28, 1995
Grant dateJul 13, 1999
Priority date
Expiry dateApr 28, 2015

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S148/016
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A process for fabricating a highly stable and reliable semiconductor, comprising: coating the surface of an amorphous silicon film with a solution containing a catalyst element capable of accelerating the crystallization of the amorphous silicon film, and heat treating the amorphous silicon film thereafter to crystallize the film.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.