Practical method to make blind vias in circuit boards and other substrates
US5925206A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 21, 1997 |
| Grant date | Jul 20, 1999 |
| Priority date | — |
| Expiry date | Apr 21, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A new method of preparing blind vias in printed circuit boards and other substrates allows for the drilling of holes for connection between conductive layers, in insulating layers prior to laminating insulating layers together. Each insulative layer is prepared with patterned conductive wiring and holes are drilled through the layer at points where wiring is to connect to another level of wiring. Two layers are aligned, using mechanical, optical, or other alignment mechanisms, and subsequently laminated together. The holes are plated with conductor after lamination to form an electrical connection. Additional layers can be added by the same method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.