David B. Stone
77Patents
14h-index
102Co-inventors
87Inventor score
Filing activity: Jul 27, 1993 → Nov 15, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5530288A | Passive interposer including at least one passive electronic component | Emerging Cross-Sectional Technologies | 224 | Expired |
| US5770476A | Passive interposer including at least one passive electronic component | Emerging Cross-Sectional Technologies | 60 | Expired |
| US6373717B1 | Electronic package with high density interconnect layer | Emerging Cross-Sectional Technologies | 53 | Expired |
| US5925206A | Practical method to make blind vias in circuit boards and other substrates | Emerging Cross-Sectional Technologies | 49 | Expired |
| US5669833A | Soccer training system | Human Necessities | 49 | Expired |
| US6156484A | Gray scale etching for thin flexible interposer | Physics | 48 | Expired |
| US6351393B1 | Electronic package for electronic components and method of making same | Emerging Cross-Sectional Technologies | 37 | Expired |
| US5734560A | Cap providing flat surface for DCA and solder ball attach and for sealing plated through holes, multi-layer electronic sturctures including the cap | Emerging Cross-Sectional Technologies | 30 | Expired |
| US6538213B1 | High density design for organic chip carriers | Electricity | 20 | Expired |
| US5669775A | Assembly for mounting components to flexible cables | Electricity | 20 | Expired |
| US5781413A | Method and apparatus for directing the input/output connection of integrated circuit chip cube configurations | Electricity | 16 | Expired |
| US5659951A | Method for making printed circuit board with flush surface lands | Emerging Cross-Sectional Technologies | 15 | Expired |
| US5875011A | Liquid crystal display tile interconnected to a tile carrier and method | Electricity | 15 | Expired |
| US6829823B2 | Method of making a multi-layered interconnect structure | Emerging Cross-Sectional Technologies | 14 | Expired |
| US6793500B1 | Radial contact pad footprint and wiring for electrical components | Emerging Cross-Sectional Technologies | 13 | Expired |
| US5759046A | Dendritic interconnection system | Electricity | 13 | Expired |
| US6248958A | Resistivity control of CIC material | Emerging Cross-Sectional Technologies | 12 | Expired |
| US8294025B2 | Lateral collection photovoltaics | Emerging Cross-Sectional Technologies | 12 | Active |
| US5403420A | Fabrication tool and method for parallel processor structure and package | Emerging Cross-Sectional Technologies | 11 | Expired |
| US5777705A | Wire bond attachment of a liquid crystal display tile to a tile carrier | Electricity | 11 | Expired |
| US9059127B1 | Packages for three-dimensional die stacks | Electricity | 9 | Active |
| US9209141B2 | Shielded package assemblies with integrated capacitor | Electricity | 8 | Active |
| US7102377B1 | Packaging reliability superchips | Electricity | 8 | Expired |
| US5773195A | Cap providing flat surface for DCA and solder ball attach and for sealing plated through holes, multi-layer electronic structures including the cap, and a process of forming the cap and for forming multi-layer electronic structures including the cap | Emerging Cross-Sectional Technologies | 8 | Expired |
| US9190399B2 | Thermally enhanced three-dimensional integrated circuit package | Electricity | 7 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.