Electronic component and method for producing the same
US5925973A · kind A · utility
26Cited by
27References
44Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 22, 1997 |
| Grant date | Jul 20, 1999 |
| Priority date | — |
| Expiry date | Jan 22, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/42
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
An electronic component of the present invention includes a first substrate, a second substrate, a first conductive layer constituting a terminal electrode on a first surface of the first substrate, and a first insulating layer formed on the first conductive layer, wherein the first insulating layer and the second substrate are directly bonded to each other by at least one bond selected from the group consisting of a hydrogen bond and a covalent bond.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.