Metallized oxide structure and fabrication
US5926360A · kind A · utility
13Cited by
4References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 27, 1997 |
| Grant date | Jul 20, 1999 |
| Priority date | — |
| Expiry date | Feb 27, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/008
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A structure for providing an interface with an oxide surface which exhibits both high adhesion and preferred electrical properties. An embodiment includes a capacitor structure having one or two electrodes abutting a high dielectric thin film, whereby the electrodes comprise first partial layers of metal having favorable electrical properties and second continuous layers adjacent the first partial layers, with the second layer material having been chosen for its physical properties, and wherein the second material adheres to exposed areas of the thin film through openings in the partial metal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.