Surface mounting structure
US5926375A · kind A · utility
24Cited by
6References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 3, 1996 |
| Grant date | Jul 20, 1999 |
| Priority date | — |
| Expiry date | Apr 3, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board is provided with blind connection vias which are filled with solder. The end portions of the pins of an electronic component are inserted into the connection vias, and are connected to the connection vias by solder. The electronic component is surface mounted on the circuit board with the major portions of the pins exposed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.