Multilayer printed board
US5926377A · kind A · utility
120Cited by
6References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 17, 1997 |
| Grant date | Jul 20, 1999 |
| Priority date | — |
| Expiry date | Nov 17, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer printed board has at least a signal layer, a power source layer, and a ground layer that are formed one upon another with insulation material being interposed among the layers. The board is capable of reducing radio waves to be emitted from the board. The board is provided with capacitors that are continuously or discretely formed at the edges of an overlapping pattern of the power source layer and ground layer, to pass a high-frequency current from the power source layer to the ground layer, thereby reducing the emission of radio waves.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.