Method of manufacturing a semiconductor component
US5928595A · kind A · utility
24Cited by
9References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 22, 1997 |
| Grant date | Jul 27, 1999 |
| Priority date | — |
| Expiry date | Sep 22, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C45/2701
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of manufacturing a semiconductor component includes forming a vertical side seal for a runner in a first mold plate by mating a protrusion of the first mold plate with a protrusion of a second mold plate. As an encapsulating material is forced through the runner, the vertical side seal prevents an encapsulating material from leaking out of the edge of the runner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.