Heating device for semiconductor wafers
US5930456A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 14, 1998 |
| Grant date | Jul 27, 1999 |
| Priority date | — |
| Expiry date | May 14, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B3/0047
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly of light energy sources for emitting light energy onto a wafer. In particular, the light energy sources are positioned such that many different radial heating zones are created on a wafer being heated. For instance, in one embodiment, the light energy sources form a spiral configuration. In an alternative embodiment, the light energy sources appear to be randomly dispersed with respect to each other so that no discernable pattern is present. In a third alternative embodiment of the present invention, the light energy sources form concentric rings. Tuning light sources are then placed in between the concentric rings of light.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.