Semiconductor component for vertical integration and manufacturing method

US5930596A · kind A · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Helmut Klose · Munich, DE
• Werner Weber · Munich, DE
• Emmerich Bertagnolli · Munich, DE
• Siegmar Koppe · Laatzen, DE
• Holger Hubner · Baldham, DE

Key dates

• Filing date: Sep 27, 1996
• Grant date: Jul 27, 1999
• Expiry date: Sep 27, 2016

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/14
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A terminal metallization (8) is applied onto and structured on a layer structure on the upper side of the component, the terminal metallization is applied on the upper side of an insulating layer (7) with an opening on a metallization (6) provided for electrical connection. By filling a hole produced in a covering dielectric with metal, a contact rod (12) seated on this terminal metallization (8) is formed. This contact rod is resiliently movable in a surrounding opening (14) of the component on the free part of the terminal metallization (8) anchored in the layer structure. This enables the reversible contacting of the component to a further component arranged vertically thereto, whereby the planar upper sides lying opposite one another can be brought into intimate contact because the contact rod (12) pressed against a contact (15) of the other component is pressed back into the opening (14) and an adequately firm connection of the contacts is achieved by the spring power of the terminal metallization (8).