Patent · US Expired

Method for fabricating a stacked, or crown shaped, capacitor structure

US5930625A · kind A · utility

29Cited by
15References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 24, 1998
Grant dateJul 27, 1999
Priority date
Expiry dateApr 24, 2018

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D1/712

Abstract

A method for creating a stacked, or crown shaped, capacitor structure, with increased surface area, obtained using a storage node electrode, comprised of HSG silicon grains on the surface of the storage node electrode, has been developed. An in situ procedure, allows HSG silicon seeds to be selectively formed, only on the exposed surfaces of a amorphous silicon storage node electrode shape, in an LPCVD system, directly after an HF preclean step. A subsequent anneal, again performed in situ, in the LPCVD system, results in the formation of HSG silicon grains, converted from the HSG silicon seeds.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.