Cleaning and drying photoresist coated wafers
US5932027A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 12, 1998 |
| Grant date | Aug 3, 1999 |
| Priority date | — |
| Expiry date | Jan 12, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for cleaning a semiconductor wafer. The method includes immersing a wafer in a liquid having water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the front face and the back face as the liquid is being removed. A step of introducing a carrier gas having a cleaning enhancement substance during the providing step also is included. The cleaning enhancement substance dopes the liquid which is attached to the front face and the back face to cause a concentration gradient of the cleaning enhancement substance in the attached liquid to accelerate fluid flow of the attached liquid off of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.