Thin-film vapor deposition apparatus
US5935337A · kind A · utility
38Cited by
4References
49Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 19, 1996 |
| Grant date | Aug 10, 1999 |
| Priority date | — |
| Expiry date | Apr 19, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/52
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A thin-film vapor deposition apparatus has a reaction casing defining a reaction chamber, a stage for supporting a substrate, the stage being disposed in the reaction chamber, and a shower head supported on the reaction casing in confronting relation to the stage for discharging a material gas toward the substrate on the stage for depositing a thin film on the substrate. A plurality of flow path systems are disposed in various regions of the shower head and the reaction casing for passage therethrough a heating medium to control the temperatures of the regions under the control of a temperature controller.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.