Resin composition and its use in production of multilayer printed circuit board
US5935452A · kind A · utility
19Cited by
2References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 10, 1998 |
| Grant date | Aug 10, 1999 |
| Priority date | — |
| Expiry date | Nov 10, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/122
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A resin composition comprising (a) an epoxy resin having a number average molecular weight of 1200 or less, (b) a carboxylic acid-containing acrylic or acrylonitrile-butadiene rubber, (c) a curing agent for the epoxy resin, and (d) a curing accelerator is easily chemically etched and suitable as an insulating adhesive for producing multilayer printed circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.