Method of planarizing semiconductor wafers
US5935869A · kind A · utility
10Cited by
12References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 10, 1997 |
| Grant date | Aug 10, 1999 |
| Priority date | — |
| Expiry date | Jul 10, 2017 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A CMP semiconductor wafer planarization method is provided employing an aqueous solution of a trialkanol amine as a wafer cleaning solution. Wafers are produced exhibiting a substantial reduction in semiconductor device failures as shown by a significant decrease in m.sub.1- m.sub.1 (metal to metal) shorts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.