Substrate contact for integrated spiral inductors
US5936299A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 13, 1997 |
| Grant date | Aug 10, 1999 |
| Priority date | — |
| Expiry date | Mar 13, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/20
Abstract
An inductor structure includes an inductor spiral coil formed on a substrate; and a substrate contact connected to the substrate and disposed within a predetermined distance to the inductor spiral coil to increase the quality-factor (Q) characteristics associated with the inductor structure, and also does not increase eddy currents in the substrate. The substrate contact provides for implementation of the inductor structure as a spiral inductor which is integrated on a silicon substrate. The substrate contact determines the energy potential substantially adjacent to the inductor for reducing the noise level. In an implementation of an inductor in an RF circuit, the substrate contact contributes to providing an increased Q.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.