C4 package die backside coating
US5936304A · kind A · utility
37Cited by
2References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 10, 1997 |
| Grant date | Aug 10, 1999 |
| Priority date | — |
| Expiry date | Dec 10, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to one aspect of the invention there is provided a semiconductor chip comprising a semiconductor die, an array of electrical contacts on an integrated circuit in a frontside of the die, and a protective layer on a backside of the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.