Ravi Mahajan
35Patents
15h-index
51Co-inventors
84Inventor score
Filing activity: Sep 26, 1996 → Dec 27, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9941245B2 | Integrated circuit packages including high density bump-less build up layers and a lesser density core or coreless substrate | Electricity | 232 | Active |
| US8064224B2 | Microelectronic package containing silicon patches for high density interconnects, and method of manufacturing same | Electricity | 141 | Active |
| US5804771A | "Organic substrate (PCB) slip plane ""stress deflector"" for flip chip deivces" | Emerging Cross-Sectional Technologies | 105 | Expired |
| US6191475A | Substrate for reducing electromagnetic interference and enclosure | Electricity | 83 | Expired |
| US9136236B2 | Localized high density substrate routing | Electricity | 60 | Active |
| US9269701B2 | Localized high density substrate routing | Electricity | 49 | Active |
| US6903929B2 | Two-phase cooling utilizing microchannel heat exchangers and channeled heat sink | Electricity | 49 | Expired |
| US6934154B2 | Micro-channel heat exchangers and spreaders | Electricity | 46 | Expired |
| US7851905B2 | Microelectronic package and method of cooling an interconnect feature in same | Emerging Cross-Sectional Technologies | 40 | Active |
| US5936304A | C4 package die backside coating | Electricity | 37 | Expired |
| US6043983A | EMI containment for microprocessor core mounted on a card using surface mounted clips | Electricity | 34 | Expired |
| US6706562B2 | Electronic assembly with high capacity thermal spreader and methods of manufacture | Electricity | 33 | Expired |
| US6490166B1 | Integrated circuit package having a substrate vent hole | Emerging Cross-Sectional Technologies | 19 | Expired |
| US7126822B2 | Electronic packages, assemblies, and systems with fluid cooling | Emerging Cross-Sectional Technologies | 16 | Expired |
| US6700209B1 | Partial underfill for flip-chip electronic packages | Electricity | 16 | Expired |
| US6365441B1 | Partial underfill for flip-chip electronic packages | Electricity | 15 | Expired |
| US6908845B2 | Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme | Electricity | 14 | Expired |
| US7882624B2 | Method of forming electronic package having fluid-conducting channel | Emerging Cross-Sectional Technologies | 14 | Active |
| US7508671B2 | Computer system having controlled cooling | Physics | 13 | Expired |
| US8441809B2 | Microelectronic package containing silicon connecting region for high density interconnects, and method of manufacturing same | Electricity | 12 | Active |
| US6011696A | Cartridge and an enclosure for a semiconductor package | Electricity | 10 | Expired |
| US6992381B2 | Using external radiators with electroosmotic pumps for cooling integrated circuits | Electricity | 7 | Expired |
| US7539016B2 | Electromagnetically-actuated micropump for liquid metal alloy enclosed in cavity with flexible sidewalls | Electricity | 7 | Active |
| US6239973A | EMI containment for microprocessor core mounted on a card using surface mounted clips | Electricity | 6 | Expired |
| US6173489A | "Organic substrate (PCB) slip plane ""stress deflector"" for flip chip devices" | Emerging Cross-Sectional Technologies | 3 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.