Ribbon, bonding wire and microwave circuit package
US5936492A · kind A · utility
14Cited by
9References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 22, 1997 |
| Grant date | Aug 10, 1999 |
| Priority date | — |
| Expiry date | Apr 22, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30111
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A ribbon and a bonding wire are connected respectively to a high-frequency input and output of a microwave circuit, the width of the ribbon and/or the thickness of the bonding wire being varied continuously or discontinuously at a portion other than a portion used for bonding. By applying the ribbon and bonding wire to a microwave circuit package including a metallic substrate and sealing therein an MMIC mounted to the metallic substrate, desired high-frequency characteristics of the MMIC can be obtained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.