Inspection method, inspection apparatus and method of production of semiconductor device using them
US5936726A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 9, 1997 |
| Grant date | Aug 10, 1999 |
| Priority date | — |
| Expiry date | Sep 9, 2017 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/94
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An inspection method and apparatus for discriminating the foreign particles on the surface of a sample from the foreign particles or defects within the sample, and a semiconductor-device producing method using the inspection method and apparatus. The inspection apparatus includes a light source, a first optical system that causes the light from the source to be directed to the sample, a second optical system for condensing the light coming back from the sample, a polarizing prism for separating the condensed light into polarized components, and optical detectors, for detecting the polarized components. The two optical systems, are arranged for their optical axes to make an angle of 50.degree. to 120.degree. relative to each other. The foreign particles on the surface of the sample and the foreign particles or defects within the sample are respectively discriminated from each other as side scattered light and backward scattered light by utilizing the difference between the intensity ratios of the polarized light components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.