Semiconductor component having leadframe with offset ground plane
US5936837A · kind A · utility
19Cited by
11References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 11, 1997 |
| Grant date | Aug 10, 1999 |
| Priority date | — |
| Expiry date | Aug 11, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor component includes a leadframe (11, 40) having leads (12, 41) and a ground plane (13, 42) wherein the ground plane (13, 42) has an opening (15, 45). A semiconductor substrate (21) is located in the opening (15, 45) and is approximately coplanar with the ground plane (13, 42). The coplanarity shortens the ground plane wire bonds (23) and improves the electrical performance of the semiconductor component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.