Electronics package that has a substrate with an array of hollow vias and solder balls that are eccentrically located on the vias
US5936848A · kind A · utility
31Cited by
6References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 29, 1998 |
| Grant date | Aug 10, 1999 |
| Priority date | — |
| Expiry date | May 29, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronics package includes a substrate, a via and a solder ball. The substrate has first and second opposed surfaces. The via is located within the substrate and terminates at the first surface. The via defines an opening having first and second opposed walls. The solder ball is at least partially located over the opening. The solder ball has first and second opposed sides, the first side being adjacent the first wall and the second side being adjacent the second wall. The first side is nearer to the first wall than the second side is to the second wall.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.