Wafer holding jig
US5938512A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 16, 1997 |
| Grant date | Aug 17, 1999 |
| Priority date | — |
| Expiry date | Dec 16, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B7/228
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
There is disclosed a wafer holding jig having a porous holding surface for vacuum-holding a semiconductor wafer while the wafer is ground or polished. The porosity of a center region of the holding surface is made larger than that of an outside region formed to surround the center region. The outer diameter of the center region is made less than that of the wafer, while the outer diameter of the outside region is made greater than that of the wafer. It is possible to prevent deterioration in machining accuracy, which deterioration would otherwise occur due to deformation of a wafer stemming from catch of dust or the like, or application of machining pressure to the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.